2 months ago I bought the HP OMEN 17-cb1378ng (http://einfach-anders.at/go/2hPmIw7) gaming notebook. The graphics card is an RTX 2070 (mobile) and an i7-10750h processor.
The problem lies in the temperature when playing actively (Warzone (Highest Settings)), everything is in the green with the graphics card, there's no more than 70 degrees. It starts with the CPU, the game runs with smooth FPS, but the CPU is at 97 to 98 degrees with undervolting. I already unscrewed the laptop and cleaned everything. Is that normal?
If it's a gaming laptop, that's not particularly unusual
Yes! I have an Omen 16 Ryzen 7/2060 and laptop CPUs can get really hot. If it reaches over 105 degrees it is problematic. But always go to the performance mode in the Omen Gaming Hub!
In the comfort mode, the temperature drops to 91 degrees and in the performance mode it rises to 97 - 98
Laptop screwed on? Congratulations your warranty has expired. It shouldn't be dusty in 2 months, that's nonsense. You could set the fan speed in the BIOS at least in my Asus laptop. Try it out.
Nope looked there's no option in the BIOS
Ok but that may be due to the display so that is still acceptable. You just have to switch between power control and system-important functions then the temp is updated. Display
Hmm gaming laptop and no setting for fans and various? Well, as one wrote, up to 105 degrees seems to be in the green area. In summer it could be problematic but it will be fine, have fun.
Yes, with such extremely tightly limited housing requirements, there are always problems if it is not supposed to be extremely clunky and loud like a "DTR".
The graphics card (XMX module) may have its own cooling system, but the CPU, mainboard and its own voltage supply still need their own and not to be underestimated cooling mechanisms, if only the two-contact supply of the battery and power supply unit is supplied.
Although a lot has happened in terms of efficiency in notebook technology, the CPU and GPU are not the only components today that require heat dissipation, especially in notebooks.
The more modern, the smaller the chip areas become with ever higher energy density per mm2 on the cooler. In the meantime, you would have to solder the transfer almost directly with silver instead of still messing around with low-temperature solder with around 20 to 30 W / mK.
With the lowest possible temperature difference, even the most modern heat pipe technologies are still overwhelmed.
The bottom line is that despite the fact that performance is better, it is still at least the same ailment with high-performance DTR… Get rid of around 200 to 300 watts of real thermal energy in the smallest of spaces. (In addition to more and more requirements on the control media in the power transfer to the temperature difference.
At 7 nm, as with AMD, one should already have a heat transfer of well over 100 W / m × K compared to older structures.
Pastes, however, are still somewhere between 7 - 15, and for liquid metals no higher than around 15 - 20 in the transfer.
Heat pipes in themselves are also limited in terms of heat transfer and the temperatures between hot and cooling, although they are already hypertransferring compared to pure copper. (other technique)
Ultimately, the same physics remains in the transition to air as it was 15 to 20 years ago. Temperature gradient between chipset via transmission to cooling fin surface and air throughput at rel. Humidity.
Yeah thanks
